| Electrodeposited Copper
on Metallic Surfaces |
Mil-C-14550B
Thickness |
|
|
Class 0 |
.001-.005 inch |
For heat treatment stop off shield |
| Class 1 |
.001 inch |
For carburizing shield, printed circuit board
plated through holes |
| Class 2 |
.0005 inch |
As undercoating for Nickel and other metals |
| Class 3 |
.0002 inch |
To prevent metal migration into tin layer to poison
solderability |